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ICES 670

COM Express Type 6, Basic Module with Mobile Intel® QM87 chipset 4th Generation Intel® Core™ Processors
  • Main Feature
  • Intel® 4th generation Core™ processor
  • Mobile Intel® QM87 chipset
  • Support PICMG COM.0 Rev. 2.1 Type 6 pin-outs
  • Support Dual channel ECC-DDR3L/ SO-DIMMs 1333/1600MHz up to 16GB
  • Support PCIe x16, 7x PCIe x 1, 4x USB3.0/ 8x USB2.0, 2x SATA3.0/ 2x SATA2.0 and GbE
  • Up to 3x independent displays, VGA, eDP/ LVDS, DVI, HDMI, DisplayPort
  • Dimension 95 x 125mm2 (W x L)
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Datasheet(PDF)
CPU Support Support Intel® BGA 1364, 4th generation Intel® Core™ processors (Haswell-M/ Shark Bay-MB)
Main Memory Dual ECC-DDR3L/ SO-DIMMs, support 1333/1600MHz memory up to 16GB
Platform Control Hub Intel® 8 series (Lynx Point-M) PCH chipset
BIOS AMI System UEFI BIOS Plug and play support Advanced power management and advanced configuration & power interface support
Audio HD audio interface
On-board LAN Intel® Clarkville(I217) Gigabit Ethernet, support next generation vPro/iAMT Support PXE boot from LAN, wake on LAN function Signals down to I/O board
COM Express Connector AB
VGA/ LVDS/ 8x USB2.0 / HD Audio/ 4x SATA/ GbE/ GPIO/ LPC bus,1x PCIe x4/ 2x PCIe x1/ SMBus (I2C)/ SPI BIOS /SPK out CD
PCIex16/ 3x DDI /4x USB 3.0/ 1x PCIe x1
Power Requirements +12V, +5VSB, +3.3V RTC power
Dimensions 95mm (W) x 125mm (L)
Environment Board level operating temperatures: -15°C to 60°C Storage temperatures: -20°C to 80°C Relative humidity:
10% to 90% (operating, non-condensing)
5% to 95% (non-operating, non-condensing)
Certifications Meet CE FCC Class A
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