MVS 2623-GCIoT

Google Cloud AI Edge Telematics Solution

Main Feature
Built-in Google Edge TPU ML accelerator coprocessor
Modular design for flexible I/O expansion
Three SIM cards + dual WWAN modules support
8 x 10/100/1000 Mbps 802.3af PoE ports
Built-in u-blox NEO-M8N module, optional dead reckoning support
Intel Atom® x7, 4c, 2.0GHz E3950
Dual removable SATA 3.0 2.5” SSD/HDD
iButton for driver ID identification
Built-in CAN 2.0B optional OBDII function (SAE J1939/J1708)
Pattern number M531607 registered, an easy way to expand diverse I/O cards

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Datasheet(PDF)

CPU	Intel Atom® x7, 4C, 2.0GHz E3950 (Apollo Lake)
Memory	204-Pin DDR3L SO-DMIM socket support 1600MHz up to 8GB, default 4GB industrial grade memory
Google Edge TPU (Coral ML Accelerator Card)	Hardware interface: mini-PCIe (half size) Serial interface: PCIe Gen2 x1 Performance: 4TOPS @2Watt Operating voltage: 3.3V +/- 10 % Dimensions: 30mm x 26.8mm x 2.5 mm
Storage	2 x 2.5” SATA 3.0 SSD/HDD, removable & hot swappable (optional lockable storage available)
Expansion	1 x Full size mini-PCIe socket (USB 2.0) 1 x Full size mini-PCIe socket (USB 2.0 + PCIe) 1 x Half size mini-PCIe socket (USB 2.0 + PCIe)
GNSS and On Board Sensor	1 x Default U-blox NEO-M8N GNSS module for GPS/Gloness/QZSS/Galileo/Beidou Optional modules with Dead Reckoning available Built-in G-sensor
Power over Ethernet	8-Port RJ45 for 10/100/1000 Mbps PoE IEEE 802.3af conformity, total 60W
Security	TPM 2.0
I/O Interface-Front	6 x LED indicators for power/storage/WLAN/WWAN/status/health 1 x Reset button 1 x USB type A USB 2.0 port 2 x Phone jacks 3.5mm for 1 x Mic-in and 1 x Line-out 1 x Externally accessible SIM card sockets 2 x Antenna holes for WWAN/WLAN/BT/GPS
I/O Interface-Rear	8 x RJ45 10/100/1000 Mbps PoE ports with LED 2 x RJ45 10/100/1000 Intel® Fast Ethernet with LED 1x 5-pin terminal block 9~36VDC-IN & 1x 3-pin terminal block for power cascade 2 x USB type A USB 3.0 port 2 x Phone jacks 3.5mm for 1 x Mic-in and 1 x Line-out 1 x DB-15 VGA, resolution up to 2560 x 1600 @60Hz 1 x HDMI port, resolution up to 2560 x 1600 @60Hz 2 x DB-9 RS-232 1 x DB-9 RS-232/422/485 (RI/5V/12V selectable) 1 x 12VDC output (2A) + SM Bus + 2 x MDI + power button 1 x DB9 connector for optional DR signal input, 2 x MDO and iButton - 1 x 16-Pin terminal block connector - 1 x CAN Bus 2.0B (on board) - 1 x OBDII from optional VIOB-CAN-03 module (SAE J1939) - 1 x CAN Bus 2.0B from optional VIOB-CAN-03 module - 8 x Programmable GPIO (4 x Digital inputs in default) Input voltage (source type): 5VDC TTL (default) Input voltage (external type): 3~12VDC (4 x Digital outputs in default) Digital output (source type): 5VDC TTL (default), max current: 20mA Digital output (external type): 3~24VDC, max current: 150mA 1 x Externally acessible SIM card socket and 1x internal SIM card socket selectable
Power Management	9~36VDC-IN with ignition control (100W in max.) Selectable boot-up & shut-down voltage for low power protection by software. Setting 8-level power on/ off delay time by software. Support S3/S4 suspend mode
Rechargeable Battery (option)	Lithium-ion polymer Nominal capacity 1100mAh Maximum charge current 1.0CmA
Operating System	Debian Linux and other variants
Dimensions	260mm (W) x 196mm (D) x 79.6mm (H) (10.24” x 7.72” x 3.13”) 4kg
Environment	Operating temperatures - -30°C~60°C (w/ Google Edge TPU & industrial SSD) with air flow Storage temperatures: -40°C~80°C Relative humidity: 10% to 90% (non-condensing) Vibration (random) - 1.2g@5~500 Hz (in operation, HDD), 2.5g@5~500 Hz (in operation, SSD) Vibration (SSD/HDD) - Operating: MIL-STD-810G, Method 514.6, Category 4, common carrier US highway truck vibration exposure - Storage: MIL-STD-810G, Method 514.6, Category 24, minimum integrity test Shock (SSD/HDD) - Operating: MIL-STD-810G, Method 516.6, Procedure I, functional shock=20g - Non-operating: MIL-STD-810G, Method 516.6, Procedure V, crash hazard shock test=75g
Certifications	CE approval, FCC Class A, E13 mark

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