| CPU | ARM® Cortex™-A9 processor embedded in BCM56340 |
| SDRAM | 512MBytes DDR3 SDRAM |
| Flash | 256MBytes NAND flash |
| Networking | Chipset: BCM56340 + B50282 + BCM59111 |
| Physical | Construction: metal top/bottom case and aluminum panel Dimensions: 19”design, 441mm(W) x 44mm(H) x 450mm(D) Mounting: rack mount and rack rail |
| Display | OLED panel: external uOLED (uOLED-96-G2) |
| I/O Interface-Front | LAN: 6 x 2 x 4 RJ45 w/ status LED port SFP+: 2 x 2 SFP+ cage (10G) |
| I/O Interface-Rear |
QSFP+: 1X2 QSFP+ cage (21G)
Power connector: hot swap modularize AC power connector (default shipping two power units) Reset button x 1 |
| Power | Power voltage: hot swap dual modularize AC power input 90~264VAC 50/60Hz |
| Internal I/O | Console: serial port (RS232 DB9 female) |
| PoE |
PSE - BCM59111 (IEEE802.3at per port 30W) - Total power budget base on Power |
| System Cooling | Cooling method: with smart Fan (0~6200rpm) Cooler type: passive aluminum heat sink |
| Environment |
Ventilation: IP30 (the access probe of 2.5mm diameter shall not penetrate) Operating temp.: 0~45 °C Storage temp.: -20~75 °C Relative humidity: 10%~90% non-condensing Vibration: test specification for SIT spec Shock: non-OP shock (refer to IEC68-2-27) Acoustic noise: ISO 11201:1995 (E)/ISO 7779:1999/ Amd.1:2003 (E) EMI/EMC:CE/FCC Class A ESD: 2/4KV contact discharge, 2/4/8KV air discharge, Criteria B Safety: CB |